Invention Grant
- Patent Title: Multilayer coil component
- Patent Title (中): 多层线圈组件
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Application No.: US12778694Application Date: 2010-05-12
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Publication No.: US07889044B2Publication Date: 2011-02-15
- Inventor: Mitsuru Ueda , Masaharu Konoue , Hiroki Hashimoto , Tatsuya Mizuno
- Applicant: Mitsuru Ueda , Masaharu Konoue , Hiroki Hashimoto , Tatsuya Mizuno
- Applicant Address: JP
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP
- Agency: Studebaker & Brackett PC
- Agent Tim L. Brackett, Jr.
- Priority: JP2008-243622 20080924
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28

Abstract:
A multilayer coil component is provided in which solder fusibility and a self-alignment property are prevented from being degraded due to absorption of a flux in a soldering step. The multilayer coil component has no voids present at interfaces between internal conductors 2 and a magnetic ceramic 11 located therearound. A magnetic ceramic forming a central region 7 has a region (side gap portion 8) which extends from a side surface 3a of the magnetic ceramic element to the internal conductors and which has a pore area ratio of 6% to 20%. At least one of a first external layer region 9a, located at an upper side of the central region, and a second external layer region 9b, located at a lower side of the central region (an external layer region at a mounting surface side of a mounting substrate), has a pore area ratio of less than 5%.
Public/Granted literature
- US20100225437A1 MULTILAYER COIL COMPONENT Public/Granted day:2010-09-09
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