Invention Grant
- Patent Title: Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards
- Patent Title (中): 用于抑制多层印刷电路板中的电磁耦合和开关噪声的电路和方法
-
Application No.: US11698401Application Date: 2007-01-26
-
Publication No.: US07889134B2Publication Date: 2011-02-15
- Inventor: William E. McKinzie, III , Shawn D. Rogers
- Applicant: William E. McKinzie, III , Shawn D. Rogers
- Applicant Address: US MD Fulton
- Assignee: Wemtec, Inc.
- Current Assignee: Wemtec, Inc.
- Current Assignee Address: US MD Fulton
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: H01Q1/38
- IPC: H01Q1/38
Abstract:
Apparatus for suppressing noise and electromagnetic coupling in the printed circuit board of an electronic device includes an upper conductive plate and an array of conductive coplanar patches positioned a distance t2 from the upper conductive plate. The distance t2 is chosen to optimize capacitance between the conductive coplanar patches and the upper conductive plate for suppression of noise or electromagnetic coupling. The apparatus further includes a lower conductive plate a distance t1 from the array of conductive coplanar patches and conductive rods extending from respective patches to the lower conductive plate.
Public/Granted literature
Information query
