Invention Grant
- Patent Title: Mounting device
- Patent Title (中): 安装装置
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Application No.: US12178924Application Date: 2008-07-24
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Publication No.: US07889276B2Publication Date: 2011-02-15
- Inventor: Yoshikazu Nakamura , Toshiaki Yamada
- Applicant: Yoshikazu Nakamura , Toshiaki Yamada
- Applicant Address: JP Tokyo
- Assignee: Hoya Corporation
- Current Assignee: Hoya Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JP2007-196029 20070727
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N5/64 ; G02F1/1333

Abstract:
A mounting device is provided having a base, first mounting arms, second mounting arms, first engaging portions, and second engaging portions. The base is annular and has an elastic body. Both first and second mounting arms have elastic bodies and extend from said base in the outward radial direction of said base. The first engaging portions project orthogonally to the axis of said base from the edge of said first mounting arms. The second engaging portions project in the direction opposite to the projection direction of said first engaging portions, from the edge of said second mounting arms. The first engaging portions project parallel to each other in the same direction.
Public/Granted literature
- US20090066875A1 MOUNTING DEVICE Public/Granted day:2009-03-12
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