Invention Grant
- Patent Title: Cover structure and electronic device using the same
- Patent Title (中): 盖结构和电子装置使用相同
-
Application No.: US12422356Application Date: 2009-04-13
-
Publication No.: US07889493B2Publication Date: 2011-02-15
- Inventor: Tsung-Han Lee
- Applicant: Tsung-Han Lee
- Applicant Address: HK Kowloon
- Assignee: FIH (Hong Kong) Limited
- Current Assignee: FIH (Hong Kong) Limited
- Current Assignee Address: HK Kowloon
- Agent Steven M. Reiss
- Priority: CN200810304486 20080912
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00
Abstract:
A cover structure comprises: a substrate defined a sliding slot and an opening adjacent to the sliding slot; a covering board defined a receiving portion; an alignment plate defined a salient point, and an aperture aligned with the opening; the alignment plate is fixed on the substrate, the covering board is slidably positioned in the sliding slot and between the substrate and the alignment plate, and the salient point is received in the receiving portion to lock the covering board.
Public/Granted literature
- US20100066219A1 COVER STRUCTURE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2010-03-18
Information query
