Invention Grant
- Patent Title: Heat spreading circuit assembly
- Patent Title (中): 散热电路组件
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Application No.: US11267933Application Date: 2005-11-04
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Publication No.: US07889502B1Publication Date: 2011-02-15
- Inventor: Bradley E. Reis , James R. Cartiglia
- Applicant: Bradley E. Reis , James R. Cartiglia
- Applicant Address: US OH Parma
- Assignee: GrafTech International Holdings Inc.
- Current Assignee: GrafTech International Holdings Inc.
- Current Assignee Address: US OH Parma
- Agency: Waddey & Patterson, P.C.
- Agent James R. Cartiglia
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A circuit assembly including a substrate which has a dielectric layer, a heat spreader layer located at a first surface of the substrate, a heat generating component located at a second surface of the substrate, and a thermal pathway in thermal connection between the heat spreader layer and the heat generating component.
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