Invention Grant
- Patent Title: Electronic appliance having an electronic component and a heat-dissipating plate
- Patent Title (中): 具有电子部件和散热板的电子设备
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Application No.: US11822934Application Date: 2007-07-11
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Publication No.: US07889503B2Publication Date: 2011-02-15
- Inventor: Takeshi Nagareda , Yasuhisa Kitano , Sadayoshi Hattori
- Applicant: Takeshi Nagareda , Yasuhisa Kitano , Sadayoshi Hattori
- Applicant Address: JP Kyoto
- Assignee: Nintendo Co., Ltd.
- Current Assignee: Nintendo Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2006-235940 20060831
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34 ; H01B7/42
Abstract:
An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.
Public/Granted literature
- US20080055861A1 Electronic appliance Public/Granted day:2008-03-06
Information query
