Invention Grant
- Patent Title: Pattern matching method and pattern matching program
- Patent Title (中): 模式匹配方法和模式匹配程序
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Application No.: US11723577Application Date: 2007-03-21
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Publication No.: US07889909B2Publication Date: 2011-02-15
- Inventor: Hiroyuki Shindo , Akiyuki Sugiyama , Takumichi Sutani , Hidetoshi Morokuma , Hitoshi Komuro
- Applicant: Hiroyuki Shindo , Akiyuki Sugiyama , Takumichi Sutani , Hidetoshi Morokuma , Hitoshi Komuro
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-077955 20060322
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
It is an object of the invention to provide a suitable method for identifying depression/protrusion information in a design data; and a program and an apparatus for the same; for example, even in the case that similar portions are arranged, to provide a method for enabling a pattern matching with high precision between the design data and an image obtained by an image formation apparatus or the like; and a program and an apparatus for the same. To attain the above object, a pattern matching method, wherein, using information concerning a depression and/or a protrusion of the pattern on the design data, or a pattern portion and/or a non-pattern portion on the design data, pattern matching is executed between the pattern on the design data and the pattern on said image; and a program for the same are provided.
Public/Granted literature
- US20070223803A1 Pattern matching method and pattern matching program Public/Granted day:2007-09-27
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