Invention Grant
- Patent Title: Cooling mechanism of fixing device
- Patent Title (中): 定影装置的冷却机构
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Application No.: US12044089Application Date: 2008-03-07
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Publication No.: US07890015B2Publication Date: 2011-02-15
- Inventor: Takaho Watanabe
- Applicant: Takaho Watanabe
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Tec Kabushiki Kaisha
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Tec Kabushiki Kaisha
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Turocy & Watson, LLP
- Main IPC: G03G15/20
- IPC: G03G15/20 ; G03G21/00
Abstract:
In a cooling mechanism for a fixing device according to an embodiment of the invention, a duct that flows outer air taken in by a fan is attached firmly to a slit formed between a bent coil part at an end part of a coil and a magnetic core in an induction heating device. The bent coil part is directly cooled without exerting influence of outer air on a heat roller, and temperature rise in the bent coil part is securely prevented.
Public/Granted literature
- US20080304854A1 COOLING MECHANISM OF FIXING DEVICE Public/Granted day:2008-12-11
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