Invention Grant
- Patent Title: Conductor junctions for medical electrical leads
- Patent Title (中): 医用电线导体接头
-
Application No.: US11669432Application Date: 2007-01-31
-
Publication No.: US07890184B2Publication Date: 2011-02-15
- Inventor: Craig T. Huotari , Joseph F. Lessar , Mark D. Breyen , Ryan Thomas Bauer
- Applicant: Craig T. Huotari , Joseph F. Lessar , Mark D. Breyen , Ryan Thomas Bauer
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: A61N1/05
- IPC: A61N1/05

Abstract:
A core component of a medical electrical lead extends within an inner conductive surface of a conductive ring such that an outer surface of the core holds a portion of a conductor against the inner conductive surface for electrical contact therewith. The outer surface of the core may be deformed by a compressive force of the conductor portion having been forced against the inner surface of the ring. Such a conductor junction may be formed by pushing the ring over the core to capture the conductor portion between the ring and the core and thereby displace a layer of insulation surrounding the conductor portion. The inner surface of the ring preferably has a diameter at one, or both terminal ends that is greater than a diameter of the inner surface between the ends.
Public/Granted literature
- US20080178449A1 CONDUCTOR JUNCTIONS FOR MEDICAL ELECTRICAL LEADS Public/Granted day:2008-07-31
Information query