Invention Grant
- Patent Title: Method of determining mounting condition
- Patent Title (中): 确定安装条件的方法
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Application No.: US12279072Application Date: 2007-03-20
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Publication No.: US07890204B2Publication Date: 2011-02-15
- Inventor: Yasuhiro Maenishi
- Applicant: Yasuhiro Maenishi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-087746 20060328; JP2006-091381 20060329
- International Application: PCT/JP2007/056521 WO 20070320
- International Announcement: WO2007/119541 WO 20071025
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
To provide a method for determining a mounting condition to be set for at least one apparatus among apparatuses for manufacturing component-mounted boards. The method includes: determining, from among the apparatuses, a specific apparatus which satisfies a predetermined standard in performance associated with a manufacturing operation; obtaining the mounting condition associated with the manufacturing operation from the specific apparatus determined in the determining; and setting the mounting condition obtained in the obtaining for an apparatus other than the specific apparatus.
Public/Granted literature
- US20090204251A1 METHOD OF DETERMINING MOUNTING CONDITION Public/Granted day:2009-08-13
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