Invention Grant
- Patent Title: Method of structuring a credit having a repayment obligation
- Patent Title (中): 构建具有还款义务的信用证的方法
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Application No.: US09823376Application Date: 2001-03-30
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Publication No.: US07890392B1Publication Date: 2011-02-15
- Inventor: George H. Butcher, III
- Applicant: George H. Butcher, III
- Applicant Address: US NY New York
- Assignee: Goldman Sachs & Co.
- Current Assignee: Goldman Sachs & Co.
- Current Assignee Address: US NY New York
- Agency: Chadbourne & Parke LLP
- Agent Walter G. Hanchuk
- Main IPC: G06Q40/00
- IPC: G06Q40/00

Abstract:
In one embodiment a method of structuring a credit having a repayment obligation is provided, including: setting an expected maturity date and a final maturity date for the credit; requiring that the repayment obligation be met by the expected maturity date unless at least one predefined event occurs; and requiring that the repayment obligation be met by the final maturity date to the extent that the repayment obligation is not met by the expected maturity date. In another embodiment a method of structuring a bond issued by a bond issuer, wherein the bond has associated therewith a repayment obligation, is provided, including: setting an expected payment date and a legal maturity date for the bond; requiring that the bond issuer establish revenue rates sufficient to pay the repayment obligation by the expected payment date; and deferring the payment of the repayment obligation as late as the legal maturity date to the extent that the repayment obligation is not met by the expected payment date.
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