Invention Grant
- Patent Title: Die cutting under vacuum through rollers
- Patent Title (中): 在真空下通过滚筒进行模切
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Application No.: US11491885Application Date: 2006-07-24
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Publication No.: US07895926B2Publication Date: 2011-03-01
- Inventor: James L. May, II , David Arthur Hunwick
- Applicant: James L. May, II , David Arthur Hunwick
- Applicant Address: CA Kitchener
- Assignee: Ontario Die International Inc.
- Current Assignee: Ontario Die International Inc.
- Current Assignee Address: CA Kitchener
- Agency: Woods Oviatt Gilman LLP
- Priority: CA2513158 20050725
- Main IPC: B26F1/42
- IPC: B26F1/42 ; B26F1/38

Abstract:
In a process and apparatus for cutting a sheet material, one or more sheets of the material are placed over a die attached to a die board. A cutting pad is placed over the sheet material. Seals are placed around or between the die board and cutting pad to create an enclosure. A vacuum is created in the enclosure or between the die board and cutting pad so as to draw the die board and cutting pad together and compress the sheets of material. The resulting assembly is passed through a roller press to cut the sheets of material. A process or apparatus for mounting dies to a die board or stripping scrap from between dies and a quick release fastener are also described.
Public/Granted literature
- US20070039436A1 Die cutting under vacuum through rollers Public/Granted day:2007-02-22
Information query
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