Invention Grant
US07896049B2 Semiconductor wafer holding method, semiconductor wafer holding apparatus and semiconductor wafer holding structure
有权
半导体晶片保持方法，半导体晶片保持装置和半导体晶片保持结构
- Patent Title: Semiconductor wafer holding method, semiconductor wafer holding apparatus and semiconductor wafer holding structure
- Patent Title (中): 半导体晶片保持方法，半导体晶片保持装置和半导体晶片保持结构
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Application No.: US11882665Application Date: 2007-08-03
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Publication No.: US07896049B2Publication Date: 2011-03-01
- Inventor: Masayuki Yamamoto
- Applicant: Masayuki Yamamoto
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2006-215959 20060808
- Main IPC: B29C65/52
- IPC: B29C65/52
Abstract:
On a back face of a semiconductor wafer, an annular convex portion is formed at an outer periphery so as to surround a flat concave portion formed by back grinding. The back face of the semiconductor wafer is pressed against an adhesive surface of a supporting adhesive tape joined to a ring frame. Thus, the annular convex portion is joined to the adhesive tape. Further, the adhesive tape is deformed while being pressed from a side of its non-adhesive surface. As a result, the adhesive tape is pushed into and joined to the flat concave portion of the back face of the semiconductor wafer.
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