Invention Grant
US07896222B2 Manufacture of shape memory alloy cellular materials and structures by transient-liquid reactive joining
有权
通过瞬态液体反应性接合制造形状记忆合金细胞材料和结构
- Patent Title: Manufacture of shape memory alloy cellular materials and structures by transient-liquid reactive joining
- Patent Title (中): 通过瞬态液体反应性接合制造形状记忆合金细胞材料和结构
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Application No.: US11664016Application Date: 2005-09-30
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Publication No.: US07896222B2Publication Date: 2011-03-01
- Inventor: John A. Shaw , David S Grummon
- Applicant: John A. Shaw , David S Grummon
- Applicant Address: US MI Ann Arbor US MI East Lansing
- Assignee: Regents of The University of Michigan,Board of Trustees of Michigan State University
- Current Assignee: Regents of The University of Michigan,Board of Trustees of Michigan State University
- Current Assignee Address: US MI Ann Arbor US MI East Lansing
- Agency: Marshall, Gerstein & Borun LLP
- International Application: PCT/US2005/035348 WO 20050930
- International Announcement: WO2007/001392 WO 20070104
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K20/22

Abstract:
This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired in a form such as corrugated sheet, discrete tubes or wires, may be joined together using the newly discovered technique. Pure niobium when brought into contact with Nitinol at elevated temperature, liquefies at temperatures below the melting point and flows readily into capillary spaces between the elements to be joined, thus forming a strong joint. A series of diagrams of the interface at various stages of brazing is illustrated by FIG. 10.
Public/Granted literature
- US20080290141A1 Manufacture of Shape Memory Alloy Cellular Materials and Structures by Transient-Liquid Reactive Joining Public/Granted day:2008-11-27
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