Invention Grant
US07896267B2 Dispersing or milling apparatus, and dispersing or milling method using same
有权
分散或研磨设备,以及分散或研磨方法使用
- Patent Title: Dispersing or milling apparatus, and dispersing or milling method using same
- Patent Title (中): 分散或研磨设备,以及分散或研磨方法使用
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Application No.: US12070324Application Date: 2008-02-14
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Publication No.: US07896267B2Publication Date: 2011-03-01
- Inventor: Takamasa Ishigaki , Ji-Guang Li , Kimitoshi Sato , Hidehiro Kamiya , Yoshitaka Inoue , Choji Hatsugai , Takashi Suzuki
- Applicant: Takamasa Ishigaki , Ji-Guang Li , Kimitoshi Sato , Hidehiro Kamiya , Yoshitaka Inoue , Choji Hatsugai , Takashi Suzuki
- Applicant Address: JP
- Assignee: National Institute for Materials Science & Inoue Mfg., Inc.
- Current Assignee: National Institute for Materials Science & Inoue Mfg., Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2007-039179 20070220
- Main IPC: B02C19/16
- IPC: B02C19/16

Abstract:
A material to be treated containing solid particles in a liquid is stirred together with milling media, and irradiated with ultrasonic waves during stirring to finely mill the solid particles to nanometer size and disperse the solid particles in the liquid. The ultrasonic waves create cavitation in the liquid and upon decay of the cavitation, shock waves are produced that cause the solid particles to vigorously collide with one another and with the milling media and these collisions, together with the shearing forces created by collision of the milling media, can produce on a commercial scale nano particles having an average particle size of at most 100 nm.
Public/Granted literature
- US20080197218A1 Dispersing or milling apparatus, and dispersing or milling method using same Public/Granted day:2008-08-21
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