Invention Grant
- Patent Title: Heat system, heat method, and program
- Patent Title (中): 加热系统,加热方法和程序
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Application No.: US12071923Application Date: 2008-02-27
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Publication No.: US07896649B2Publication Date: 2011-03-01
- Inventor: Noriaki Koyama , Wenling Wang
- Applicant: Noriaki Koyama , Wenling Wang
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2007-051494 20070301
- Main IPC: G06F19/00
- IPC: G06F19/00 ; C23C16/52

Abstract:
The present invention provides a heating system, a heating method and a program, which can readily control processing temperature. A temperature calculating computer 4 of the heating system includes a device DB 42. The device DB 42 stores therein a temperature correcting table indicative of a relationship between an accumulated film thickness of extraneous matter attached to the interior of each heating apparatus and a temperature correcting amount, with respect to each heating apparatus, for each temperature (processing temperature) in the heating apparatus. Thus, the temperature correcting amount can be specified based on the temperature correcting table, the processing temperature and the accumulated film thickness, so that an optimized value can be calculated from the specified temperature correcting amount.
Public/Granted literature
- US20080213716A1 Heat system, heat method, and program Public/Granted day:2008-09-04
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