An electrical connector for receiving an IC package includes an insulative housing, a plurality of contacts received in the insulative housing, a stiffener surrounding the insulative housing and a load plate pivotally connected to the stiffener and movable between an opened position and a closed position. The load plate has a shaft and an abutting portion. The stiffener has a connecting member comprising an insertion opening for the shaft, a cavity communicated with the insertion opening for rotation of the shaft, and a supporting portion engaging with the abutting portion to keep the load plate in the opened position with a predetermined angle.