Invention Grant
- Patent Title: Modular toy vehicle
- Patent Title (中): 模块化玩具车
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Application No.: US12490307Application Date: 2009-06-23
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Publication No.: US07896724B2Publication Date: 2011-03-01
- Inventor: Donald W. Amadio , James V. Mendillo , Yuk Kei Chan
- Applicant: Donald W. Amadio , James V. Mendillo , Yuk Kei Chan
- Applicant Address: US CA Irvine
- Assignee: Ridemakerz, LLP
- Current Assignee: Ridemakerz, LLP
- Current Assignee Address: US CA Irvine
- Agency: Squire, Sanders & Dempsey (US) LLP
- Main IPC: A63H17/00
- IPC: A63H17/00 ; A63H17/26

Abstract:
A modular toy vehicle design having a universal mating system between the body of the vehicle and the chassis such that multiple body styles will interchangeably mate with multiple chassis designs and where electrical interfaces are automatically established between the body and the chassis simply by mating and aligning the two together. The design allows for an electrical connection to be made in the process of mechanically mating and aligning the body of a toy vehicle to its chassis thereby powering electronic features that are physically connected to the body with the power source which is housed in the chassis. When the body is properly aligned and mounted, the electrical interfaces are automatically established. There is no separate step of plugging together mating connectors where one connector extends from a wire bundle electrically interfacing with the body and the mating connector extends from a separate wire bundle electrically interfacing with the chassis.
Public/Granted literature
- US20090264047A1 MODULAR TOY VEHICLE Public/Granted day:2009-10-22
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