Invention Grant
- Patent Title: Ultrasonic assembly method
- Patent Title (中): 超声波组装方法
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Application No.: US11994588Application Date: 2006-07-03
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Publication No.: US07896994B2Publication Date: 2011-03-01
- Inventor: Eric Soccard
- Applicant: Eric Soccard
- Applicant Address: FR Paris
- Assignee: European Aeronautic Defence and Space Company-EADS France
- Current Assignee: European Aeronautic Defence and Space Company-EADS France
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR0552028 20050704
- International Application: PCT/EP2006/063806 WO 20060703
- International Announcement: WO2007/003626 WO 20070111
- Main IPC: B32B37/00
- IPC: B32B37/00

Abstract:
A method for assembling at least two rigid thermoplastic material based parts. The two parts are superposed to have at least one interface zone, wherein at least one of the two parts includes one or plural energy directors, protruding, situated in the interface zone. At least one excited ultrasonic source is brought into contact with one of the two parts, the ultrasonic source applying a compression effort to the two parts in a region of the interface zone located opposite the ultrasonic source. The ultrasonic source is continuously displaced at the interface zone to form a continuous welded joint by fusion of the thermoplastic material in the region positioned opposite the ultrasonic source. Such a method may find particular application for assembly of stratified parts.
Public/Granted literature
- US20080210360A1 Ultrasonic Assembly Method Public/Granted day:2008-09-04
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