A method of bonding an adhesive film for die bonding to the rear surface of a wafer having a plurality of devices on the front surface, comprising the steps of holding the front surface side of the wafer on the holding surface of a chuck table for holding the wafer; supplying the adhesive film onto the rear surface of the wafer held on the chuck table; and rolling a pressing-roller while pressing it against the adhesive film supplied onto the rear surface of the wafer to bond the adhesive film to the rear surface of the wafer, wherein the step of rolling the pressing-roller is carried out in such a positional relation that a straight line connecting the center of the wafer and a notch becomes parallel to the axis of the pressing-roller.