Invention Grant
- Patent Title: Conducting belt for use with anode holder and anode holder
- Patent Title (中): 导电带用于阳极支架和阳极支架
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Application No.: US12073348Application Date: 2008-03-04
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Publication No.: US07897024B2Publication Date: 2011-03-01
- Inventor: Mitsutoshi Yahagi , Kenichi Abe , Yuji Araki , Yoshio Minami , Tomoyasu Nagayumi
- Applicant: Mitsutoshi Yahagi , Kenichi Abe , Yuji Araki , Yoshio Minami , Tomoyasu Nagayumi
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-213521 20070820
- Main IPC: C25B9/04
- IPC: C25B9/04 ; C25D17/06 ; C25D17/08
Abstract:
A conducting belt is used with an anode holder for supplying an electric current to an anode for plating a surface of a substrate such as a semiconductor wafer. The anode and the substrate are vertically disposed so as to face each other in a plating tank of a plating apparatus. The conducting belt includes a belt capable of contacting an outer circumferential edge of the anode and holding the anode.
Public/Granted literature
- US20090050473A1 Conducting belt for use with anode holder and anode holder Public/Granted day:2009-02-26
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