Invention Grant
- Patent Title: Method for manufacturing multilayer flexible printed circuit board
- Patent Title (中): 多层柔性印刷电路板的制造方法
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Application No.: US11865619Application Date: 2007-10-01
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Publication No.: US07897055B2Publication Date: 2011-03-01
- Inventor: Chih-Yi Tu , Cheng-Hsien Lin , I-Hsien Chiang
- Applicant: Chih-Yi Tu , Cheng-Hsien Lin , I-Hsien Chiang
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Foxconn Advanced Technology Inc.
- Current Assignee: Foxconn Advanced Technology Inc.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agent Jeffrey T. Knapp
- Priority: CN200610156915 20061117
- Main IPC: H01B13/00
- IPC: H01B13/00 ; B44C1/22 ; C23F1/00

Abstract:
The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.
Public/Granted literature
- US20080116166A1 METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2008-05-22
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