Invention Grant
- Patent Title: Conductor paste for ceramic substrate and electric circuit
- Patent Title (中): 陶瓷基板和电路用导体胶
-
Application No.: US12719961Application Date: 2010-03-09
-
Publication No.: US07897066B2Publication Date: 2011-03-01
- Inventor: Akira Inaba , Naoto Nakajima
- Applicant: Akira Inaba , Naoto Nakajima
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/22
- IPC: H01B1/22 ; B05D5/12 ; C04B41/88 ; H01L23/15 ; C03C8/02
Abstract:
A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 μm, and the glass powder is a Bi2O3—SiO2—B2O3 type glass powder, and the content of the glass powder is in a range of from 1 to 6 wt % based on the weight of the paste.
Public/Granted literature
- US20100155117A1 CONDUCTOR PASTE FOR CERAMIC SUBSTRATE AND ELECTRIC CIRCUIT Public/Granted day:2010-06-24
Information query
