Invention Grant
- Patent Title: Microreactor assembly incorporating interconnect backbone
- Patent Title (中): 集成互连主干的微反应器组件
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Application No.: US12340878Application Date: 2008-12-22
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Publication No.: US07897114B2Publication Date: 2011-03-01
- Inventor: Stephane Poissy , Ronan Tanguy
- Applicant: Stephane Poissy , Ronan Tanguy
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Gregory V. Bean
- Priority: EP07305007 20071221
- Main IPC: B01J19/00
- IPC: B01J19/00

Abstract:
A microreactor assembly comprising a fluidic interconnect backbone and plurality of fluidic microstructures is provided. The fluidic microstructures are supported by respective portions of the fluidic interconnect backbone, The microreactor assembly comprises a plurality of non-polymeric interconnect seals associated with the interconnect input and output ports. The interconnect input port of the fluidic interconnect backbone is interfaced with the microchannel output port of a first fluidic microstructure at one of the non-polymeric interconnect seals. The interconnect output port of the fluidic interconnect backbone is interfaced with the microchannel input port of a second fluidic microstructure at another of the non-polymeric interconnect seals. The interconnect microchannel is defined entirely by the fluidic interconnect backbone and is configured such that it extends from the non-polymeric interconnect seal at the microchannel output port of the first fluidic microstructure to the non-polymeric interconnect seal at the microchannel input port of the second fluidic microstructure without interruption by additional sealed interfaces.
Public/Granted literature
- US20090162265A1 Microreactor Assembly Incorporating Interconnect Backbone Public/Granted day:2009-06-25
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