Invention Grant
- Patent Title: Film forming method and film forming apparatus
- Patent Title (中): 成膜方法和成膜装置
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Application No.: US11910983Application Date: 2006-04-07
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Publication No.: US07897205B2Publication Date: 2011-03-01
- Inventor: Takatoshi Kameshima , Kohei Kawamura , Yasuo Kobayashi
- Applicant: Takatoshi Kameshima , Kohei Kawamura , Yasuo Kobayashi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-112625 20050408
- International Application: PCT/JP2006/307475 WO 20060407
- International Announcement: WO2006/109735 WO 20061019
- Main IPC: C23C16/00
- IPC: C23C16/00

Abstract:
A film forming method is characterized in that the method is provided with a step of introducing a processing gas including inorganic silane gas into a processing chamber, in which a mounting table composed of ceramics including a metal oxide is arranged, and precoating an inner wall of the processing chamber including a surface of the mounting table with a silicon-containing nonmetal thin film; a step of mounting a substrate to be processed on the mounting table precoated with the nonmetal thin film; and a step of introducing a processing gas including organic silane gas into the processing chamber, and forming a silicon-containing nonmetal thin film on a surface of the substrate mounted on the mounting table.
Public/Granted literature
- US20090061092A1 FILM FORMING METHOD AND FILM FORMING APPARATUS Public/Granted day:2009-03-05
Information query
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