A mold for producing a blade for office appliances, wherein a resilient member made of a heat-curable material is adhered to a base plate. The mold includes a cavity corresponding to the resilient member of the blade, a space for placing the base plate adjacent to the cavity, a runner for passing the heat-curable material therethrough and injecting the heat-curable material into the cavity, and a heating means adjacent to the cavity, for causing curing of the heat-curable material in the cavity. At least a part of said runner, including an outlet thereof, is comprised of a cold runner for maintains the heat-curable material, which remains in the cold runner, at a temperature lower than its curing temperature.