Invention Grant
- Patent Title: Release sheet and pressure-sensitive adhesive article
- Patent Title (中): 剥离片和压敏粘合剂制品
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Application No.: US11385421Application Date: 2006-03-21
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Publication No.: US07897229B2Publication Date: 2011-03-01
- Inventor: Daisuke Tomita , Yasushi Sasaki , Takuo Nishida
- Applicant: Daisuke Tomita , Yasushi Sasaki , Takuo Nishida
- Applicant Address: JP
- Assignee: Lintec Corporation
- Current Assignee: Lintec Corporation
- Current Assignee Address: JP
- Agency: Brinks Hofer Gilson & Lione
- Agent G. Peter Nichols
- Priority: JP2005-081745 20050322; JP2006-012373 20060120
- Main IPC: B32B9/00
- IPC: B32B9/00 ; B32B33/00

Abstract:
A pressure-sensitive adhesive article 100 includes a release sheet 1 constituted from a releasing agent layer 11 and a base material 12, and a pressure-sensitive adhesive sheet 2 constituted from a pressure-sensitive adhesive layer 21 and a pressure-sensitive adhesive sheet base 22. Such a pressure-sensitive adhesive article 100 has a structure in which the pressure-sensitive adhesive sheet 2 is laminated on the release sheet 1 so that the pressure-sensitive adhesive layer 21 is in contact with the releasing agent layer 11. The releasing agent layer 11 is composed of a material containing substantially no silicone compound. The releasing agent layer 11 is mainly composed of an elastomer and has a Young's modulus of 1.5 GPa or less. Preferred examples of the elastomer include polybutadiene rubber (especially, 1,4-polybutadiene rubber), polyisoprene rubber, and ethylene propylene rubber. The release sheet 1 has excellent releasability and has little adverse effect on electric components and the like.
Public/Granted literature
- US20060216452A1 Release sheet and pressure-sensitive adhesive article Public/Granted day:2006-09-28
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