Invention Grant
- Patent Title: Potting material for electronic components
- Patent Title (中): 电子元器件灌封材料
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Application No.: US10342854Application Date: 2003-01-15
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Publication No.: US07897234B2Publication Date: 2011-03-01
- Inventor: John H. Selverian , H. Steven Mackel , William D. Koenigsberg
- Applicant: John H. Selverian , H. Steven Mackel , William D. Koenigsberg
- Applicant Address: US MA Danvers
- Assignee: OSRAM SYLVANIA Inc.
- Current Assignee: OSRAM SYLVANIA Inc.
- Current Assignee Address: US MA Danvers
- Agent Carlos S. Bessone; Shaun P. Montana
- Main IPC: B32B3/02
- IPC: B32B3/02 ; B32B1/04
Abstract:
A potting compound for electronic components comprises a first composition of asphalt and sand and a second composition that attenuates the forces normally applied by the first composition when it is used alone. The force attenuator preferably comprises solvent-refined heavy paraffinic petroleum oil from about 0.1 to 20 wt % of the compound.
Public/Granted literature
- US20040137173A1 Potting material for electronic components Public/Granted day:2004-07-15
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