A reactive foil assembly for the packaging and presenting of a reactive foil. The reactive foil assembly comprising a reactive foil, a film, a flex circuit and an adhesive. The reactive foil is placed above the film such that a portion of the reactive foil does not overlap with the film. The flex circuit is also placed above the film such that the flex circuit is operably coupled to the reactive foil. The reactive foil assembly is placed over a surface such that the film adheres to the surface with the help of the adhesive. The reactive foil is ignited by an energy pulse provided by the power source and delivered by the flex circuit coupled to the power source. An exothermic reaction of the reactive foil is initiated, which provides a molten foil available for joining of two objects.