Invention Grant
- Patent Title: Method for fabricating pixel structure
- Patent Title (中): 制造像素结构的方法
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Application No.: US12105278Application Date: 2008-04-18
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Publication No.: US07897442B2Publication Date: 2011-03-01
- Inventor: Ta-Wen Liao , Chih-Chun Yang , Ming-Yuan Huang , Han-Tu Lin , Chih-Hung Shih , Chin-Yueh Liao , Chia-Chi Tsai
- Applicant: Ta-Wen Liao , Chih-Chun Yang , Ming-Yuan Huang , Han-Tu Lin , Chih-Hung Shih , Chin-Yueh Liao , Chia-Chi Tsai
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW96147035A 20071210
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for fabricating a pixel structure is disclosed. A substrate is provided. A first conductive layer is formed on the substrate, and a first shadow mask exposing a portion of the first conductive layer is disposed over the first conductive layer. Laser is used to irradiate the first conductive layer for removing the part of the first conductive layer and forming a gate. A gate dielectric layer is formed on the substrate to cover the gate. A channel layer is formed on the gate dielectric layer over the gate. A source and a drain are formed on the channel layer and respectively above both sides of the gate. A patterned passivation layer is formed to cover the channel layer and expose the drain. An electrode material layer is formed to cover the patterned passivation layer and the exposed drain.
Public/Granted literature
- US20090148987A1 METHOD FOR FABRICATING PIXEL STRUCTURE Public/Granted day:2009-06-11
Information query
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