Invention Grant
US07897451B2 Method for creating tensile strain by selectively applying stress memorization techniques to NMOS transistors
有权
通过选择性地向NMOS晶体管施加应力记忆技术来产生拉伸应变的方法
- Patent Title: Method for creating tensile strain by selectively applying stress memorization techniques to NMOS transistors
- Patent Title (中): 通过选择性地向NMOS晶体管施加应力记忆技术来产生拉伸应变的方法
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Application No.: US12123524Application Date: 2008-05-20
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Publication No.: US07897451B2Publication Date: 2011-03-01
- Inventor: Maciej Wiatr , Casey Scott , Andreas Gehring , Peter Javorka , Andy Wei
- Applicant: Maciej Wiatr , Casey Scott , Andreas Gehring , Peter Javorka , Andy Wei
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Williams, Morgan & Amerson, P.C.
- Priority: DE102007057687 20071130
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
By selectively applying a stress memorization technique to N-channel transistors, a significant improvement of transistor performance may be achieved. High selectivity in applying the stress memorization approach may be accomplished by substantially maintaining the crystalline state of the P-channel transistors while annealing the N-channel transistors in the presence of an appropriate material layer which may not to be patterned prior to the anneal process, thereby avoiding additional lithography and masking steps.
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