Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12207892Application Date: 2008-09-10
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Publication No.: US07897461B2Publication Date: 2011-03-01
- Inventor: Yoshinori Takami
- Applicant: Yoshinori Takami
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-245184 20070921
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/76

Abstract:
Disclosed is a semiconductor device having an n-type drain region, a low concentration p-type body region formed on the n-type drain region, an n-type source region formed on the low concentration p-type body region, a high concentration p-type body region formed on the low concentration p-type body region, a gate insulating film, and a gate electrode, wherein a plurality of trenches T which extend in a same direction and each of which forms a continuous concavo-convex shape when viewed from above are formed from top faces of the source region and the high concentration body region and pass through the low concentration body region to reach into the drain region, and wherein the gate electrode is buried in each of the plurality of trenches. A maximum distance between two adjacent trenches T of the n-type source region is greater than a maximum distance between the two adjacent trenches T of the high concentration p-type body region.
Public/Granted literature
- US20090078994A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2009-03-26
Information query
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