Invention Grant
- Patent Title: Overvoltage-protected light-emitting semiconductor device, and method of fabrication
- Patent Title (中): 过电压保护的发光半导体器件及其制造方法
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Application No.: US12181052Application Date: 2008-07-28
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Publication No.: US07897497B2Publication Date: 2011-03-01
- Inventor: Yasuhiro Kamii , Arei Niwa , Junji Sato , Mikio Tazima
- Applicant: Yasuhiro Kamii , Arei Niwa , Junji Sato , Mikio Tazima
- Applicant Address: JP
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP
- Agency: Woodcock Washburn LLP
- Priority: JP2006-020242 20060130
- Main IPC: H01L21/22
- IPC: H01L21/22

Abstract:
A light-generating semiconductor region is grown by epitaxy on a silicon substrate. The light-generating semiconductor region is a lamination of layers of semiconducting nitrides containing a Group III element or elements. The silicon substrate has a p-type impurity-diffused layer formed therein by thermal diffusion of the Group III element or elements from the light-generating semiconductor region as a secondary product of the epitaxial growth of this region on the substrate. The p-type impurity-diffused layer is utilized as a part of overvoltage protector diodes which are serially interconnected with each other and in parallel with the LED section of the device between a pair of electrodes.
Public/Granted literature
- US20080308823A1 OVERVOLTAGE-PROTECTED LIGHT-EMITTING SEMICONDUCTOR DEVICE, AND METHOD OF FABRICATION Public/Granted day:2008-12-18
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