Invention Grant
US07897502B2 Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers
有权
在凹陷和凸起的粘结指状物上的迹线互连上形成垂直偏移粘结的方法
- Patent Title: Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers
- Patent Title (中): 在凹陷和凸起的粘结指状物上的迹线互连上形成垂直偏移粘结的方法
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Application No.: US12207986Application Date: 2008-09-10
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Publication No.: US07897502B2Publication Date: 2011-03-01
- Inventor: KiYoun Jang , SungSoo Kim , YongHee Kang
- Applicant: KiYoun Jang , SungSoo Kim , YongHee Kang
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC, Ltd.
- Current Assignee: STATS ChipPAC, Ltd.
- Current Assignee Address: SG Singapore
- Agency: Robert D. Atkins Patent Law Group
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method of making a semiconductor device comprises forming a first conductive layer recessed below a surface of a substrate. The method further comprises forming a second conductive layer raised above the surface of the substrate to create a vertical offset between the first and second conductive layers. The method further comprises forming an interconnect structure on the first and second conductive layers.
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