Invention Grant
- Patent Title: Epoxy resin and 4,4′-diaminobenzanilide powder
- Patent Title (中): 环氧树脂和4,4'-二氨基苯甲酰苯胺粉末
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Application No.: US12468926Application Date: 2009-05-20
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Publication No.: US07897703B2Publication Date: 2011-03-01
- Inventor: Yen-Seine Wang
- Applicant: Yen-Seine Wang
- Applicant Address: US CA Dublin
- Assignee: Hexcel Corporation
- Current Assignee: Hexcel Corporation
- Current Assignee Address: US CA Dublin
- Agent W. Mark Bielawski; David J. Oldenkamp
- Main IPC: C08K7/02
- IPC: C08K7/02 ; C08K7/14 ; C08L63/00
Abstract:
Epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4′-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.
Public/Granted literature
- US20100298468A1 EPOXY RESINS WITH IMPROVED FLEXURAL PROPERTIES Public/Granted day:2010-11-25
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