Invention Grant
- Patent Title: Arrangement for hermetically sealing components, and method for the production thereof
- Patent Title (中): 气密密封部件的配置及其制造方法
-
Application No.: US11990263Application Date: 2006-07-28
-
Publication No.: US07897881B2Publication Date: 2011-03-01
- Inventor: Michael Kaspar , Herbert Schwarzbauer , Karl Weidner
- Applicant: Michael Kaspar , Herbert Schwarzbauer , Karl Weidner
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agency: Staas & Halsey LLP
- Priority: DE102005037869 20050810
- International Application: PCT/EP2006/064787 WO 20060728
- International Announcement: WO2007/017404 WO 20070215
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
Disclosed is a method for producing a package. According to said method, a substrate is provided, on a surface of which one or several components are disposed, and a hermetically sealing protective layer is formed on the one or several components and on the surface of the substrate. The hermetically sealing protective layer is impermeable to gas, liquid, and electromagnetic waves, temperature-resistant, electrically insulating, and process-resistant.
Public/Granted literature
- US20100089633A1 Arrangement for Hermetically Sealing Components, and Method for the production thereof Public/Granted day:2010-04-15
Information query
