Invention Grant
- Patent Title: Method of bonding an optical component
- Patent Title (中): 粘合光学部件的方法
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Application No.: US11586644Application Date: 2006-10-26
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Publication No.: US07897892B2Publication Date: 2011-03-01
- Inventor: Masahiro Mori , Izuru Nakai , Toshiharu Kimura , Takeshi Fujishima
- Applicant: Masahiro Mori , Izuru Nakai , Toshiharu Kimura , Takeshi Fujishima
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Steptoe & Johnson LLP
- Priority: JP2005-313600 20051028
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G11B7/00 ; B23K26/20
Abstract:
A light source (2) and a connection base (1) are held with a predetermined gap, solder paste melted by the thermal energy of laser light is fed into the gap, and the light source (2) and the connection base (1) are bonded together via a solder layer (32).
Public/Granted literature
- US20070095806A1 Method of bonding optical component, and optical pickup Public/Granted day:2007-05-03
Information query
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