Invention Grant
- Patent Title: Electronic device and semiconductor device and method for manufacturing the same
- Patent Title (中): 电子器件及半导体器件及其制造方法
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Application No.: US12504840Application Date: 2009-07-17
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Publication No.: US07897968B2Publication Date: 2011-03-01
- Inventor: Hideaki Kuwabara , Shunpei Yamazaki , Shinji Maekawa , Osamu Nakamura
- Applicant: Hideaki Kuwabara , Shunpei Yamazaki , Shinji Maekawa , Osamu Nakamura
- Applicant Address: JP Kanagawa-Ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-Ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2003-403733 20031202; JP2003-432083 20031226
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
It is conceivable that the problem that a signal is delayed by resistor of a wiring in producing a display which displays large area becomes remarkable. The present invention provides a manufacturing process using a droplet discharge method suitable for a large-sized substrate.In the present invention, after forming a base layer 11 (or base pretreatment) which enhances adhesiveness over a substrate in advance and forming an insulating film, a mask having a desired pattern shape is formed, and a desired depression is formed by using the mask. A metal material is filled in the depression having a mask 13 and a sidewall made from an insulating film by a droplet discharge method to form an embedded wiring (a gate electrode, a capacitor wiring, lead wiring or the like. Afterwards, it is flattened by a planarization processing, for example, a press or a CMP processing.
Public/Granted literature
- US20090279012A1 ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-11-12
Information query
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