Invention Grant
- Patent Title: Expandable LED array interconnect
- Patent Title (中): 可扩展的LED阵列互连
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Application No.: US11595720Application Date: 2006-11-09
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Publication No.: US07897980B2Publication Date: 2011-03-01
- Inventor: Thomas Cheng-Hsin Yuan , Bernd Keller
- Applicant: Thomas Cheng-Hsin Yuan , Bernd Keller
- Applicant Address: US CA Goleta
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US CA Goleta
- Agency: Koppel, Patrick, Heybl & Dawson
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting device that can function as an array element in an expandable array of such devices. The light emitting device comprises a substrate that has a top surface and a plurality of edges. Input and output terminals are mounted to the top surface of the substrate. Both terminals comprise a plurality of contact pads disposed proximate to the edges of the substrate, allowing for easy access to both terminals from multiple edges of the substrate. A lighting element is mounted to the top surface of the substrate. The lighting element is connected between the input and output terminals. The contact pads provide multiple access points to the terminals which allow for greater flexibility in design when the devices are used as array elements in an expandable array.
Public/Granted literature
- US20080111470A1 Expandable LED array interconnect Public/Granted day:2008-05-15
Information query
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