Invention Grant
- Patent Title: Nitride semiconductor device and method for fabricating the same
- Patent Title (中): 氮化物半导体器件及其制造方法
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Application No.: US11890480Application Date: 2007-08-07
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Publication No.: US07898002B2Publication Date: 2011-03-01
- Inventor: Masahiro Hikita , Tetsuzo Ueda , Manabu Yanagihara , Yasuhiro Uemoto , Tsuyoshi Tanaka
- Applicant: Masahiro Hikita , Tetsuzo Ueda , Manabu Yanagihara , Yasuhiro Uemoto , Tsuyoshi Tanaka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-267476 20060929
- Main IPC: H01L21/337
- IPC: H01L21/337 ; H01L21/335

Abstract:
A nitride semiconductor device includes: a substrate; a first nitride semiconductor layer formed over the substrate; a second nitride semiconductor layer formed on the first nitride semiconductor layer and having a larger band gap energy than the first nitride semiconductor layer; a third nitride semiconductor layer formed on the second nitride semiconductor layer and including a p-type nitride semiconductor with at least a single-layer structure; a gate electrode formed on the third nitride semiconductor layer; and a source electrode and a drain electrode formed in regions located on both sides of the gate electrode, respectively. The third nitride semiconductor layer has a thickness greater in a portion below the gate electrode than in a portion below the side of the gate electrode.
Public/Granted literature
- US20080079023A1 Nitride semiconductor device and method for fabricating the same Public/Granted day:2008-04-03
Information query
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