Invention Grant
- Patent Title: Insulating film and semiconductor device using this film
- Patent Title (中): 使用该膜的绝缘膜和半导体器件
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Application No.: US11689301Application Date: 2007-03-21
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Publication No.: US07898015B2Publication Date: 2011-03-01
- Inventor: Tatsuo Shimizu , Masato Koyama
- Applicant: Tatsuo Shimizu , Masato Koyama
- Applicant Address: JP Toyko
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Toyko
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-250074 20060914
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
An insulating film includes a first metal, oxygen, fluorine and one of a second metal or nitrogen, and satisfies {k×[X]−[F]}/2≦8.4 atomic %, wherein the fluorine amount [F], the one element amount [X], and a valence number difference k between the first and second metals or between oxygen and nitrogen.
Public/Granted literature
- US20080067636A1 INSULATING FILM AND SEMICONDUCTOR DEVICE USING THIS FILM Public/Granted day:2008-03-20
Information query
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