Invention Grant
- Patent Title: Semiconductor device and process for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12177602Application Date: 2008-07-22
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Publication No.: US07898036B2Publication Date: 2011-03-01
- Inventor: Hidenobu Fukutome
- Applicant: Hidenobu Fukutome
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
A semiconductor device includes a semiconductor substrate; a gate electrode formed on the semiconductor substrate; source and drain extension regions formed in the semiconductor substrate on a first and a second side corresponding to a first sidewall surface and a second sidewall surface, respectively, of the gate electrode; a first piezoelectric material pattern formed on the semiconductor substrate continuously covering the first sidewall surface of the gate electrode from the first side of the gate electrode; a second piezoelectric material pattern formed on the semiconductor substrate continuously covering the second sidewall surface of the gate electrode from the second side of the gate electrode; and source and drain regions formed in the semiconductor substrate outside the source extension region and the drain extension, respectively.
Public/Granted literature
- US20080277733A1 SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME Public/Granted day:2008-11-13
Information query
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