- Patent Title: Package, in particular for MEMS devices and method of making same
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Application No.: US12006709Application Date: 2008-01-04
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Publication No.: US07898043B2Publication Date: 2011-03-01
- Inventor: Federico Giovanni Ziglioli , Fulvio Vittorio Fontana , Mark Shaw
- Applicant: Federico Giovanni Ziglioli , Fulvio Vittorio Fontana , Mark Shaw
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics, S.r.l.
- Current Assignee: STMicroelectronics, S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Graybeal Jackson LLP
- Agent Lisa K. Jorgenson; Kevin D. Jablonski
- Priority: ITMI2007A0007 20070104; ITMI2007A0008 20070104
- Main IPC: H01L27/14
- IPC: H01L27/14
Abstract:
A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the passing opening. A protective package incorporates the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device exposed through the passing opening of the substrate.
Public/Granted literature
- US20080164543A1 Package, in particular for MEMS devices and method of making same Public/Granted day:2008-07-10
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