Invention Grant
- Patent Title: Component with a semiconductor junction and method for the production thereof
- Patent Title (中): 具有半导体结的元件及其制造方法
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Application No.: US11793361Application Date: 2005-11-28
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Publication No.: US07898052B2Publication Date: 2011-03-01
- Inventor: Anton Prantl , Franz Schrank , Rainer Stowasser
- Applicant: Anton Prantl , Franz Schrank , Rainer Stowasser
- Applicant Address: AU Osterreich
- Assignee: Austriamicrosystems AG
- Current Assignee: Austriamicrosystems AG
- Current Assignee Address: AU Osterreich
- Agency: Nexsen Pruet, LLC
- Agent Joseph T. Guy
- Priority: DE102004060365 20041215
- International Application: PCT/EP2005/012698 WO 20051128
- International Announcement: WO2006/066690 WO 20060629
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/763
Abstract:
A component comprising a semiconductor junction (HU) is proposed which is formed from crystalline doped semiconductor layers. A semiconductor circuit (IC) is formed on the surface of the component, and a diode is formed internally and directly below the circuit. Integrated circuit and diode are connected to one another and formed and integrated diode component, in particular a photodiode array.
Public/Granted literature
- US20080211051A1 Component with a Semiconductor Junction and Method for the Production Thereof Public/Granted day:2008-09-04
Information query
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