Invention Grant
- Patent Title: Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate
- Patent Title (中): 嵌入薄混合基板中的叠层式半导体芯片
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Application No.: US12365606Application Date: 2009-02-04
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Publication No.: US07898069B2Publication Date: 2011-03-01
- Inventor: Rajiv C Dunne
- Applicant: Rajiv C Dunne
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A semiconductor system having a substrate (101) including a rigid insulating interposer (110) with a high modulus and a top (140) and a bottom (150) low-modulus tape with flip-attached semiconductor chips (120, 130). The assembled chips, with the passive surfaces facing each other, are located in an opening (114) of the interposer, which has a thickness (111) equal to or smaller than the sum of the assembled two chips. Adhesive material (160) holds the tapes parallel to the interposer and the chip surfaces together. Solder balls (180) and discrete components (170) may be attached to the outside surfaces of the tapes.
Public/Granted literature
- US20090166832A1 STACKED FLIP-ASSEMBLED SEMICONDUCTOR CHIPS EMBEDDED IN THIN HYBRID SUBSTRATE Public/Granted day:2009-07-02
Information query
IPC分类:
