Invention Grant
- Patent Title: Apparatus and method for housing micromechanical systems
- Patent Title (中): 微机械系统的装置和方法
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Application No.: US11971371Application Date: 2008-01-09
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Publication No.: US07898071B2Publication Date: 2011-03-01
- Inventor: Thor Bakke , Thilo Sandner
- Applicant: Thor Bakke , Thilo Sandner
- Applicant Address: DE Munich
- Assignee: Faunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee: Faunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee Address: DE Munich
- Agency: Keating & Bennett, LLP
- Priority: DE102007001518 20070110
- Main IPC: H01L23/006
- IPC: H01L23/006
Abstract:
An apparatus for housing a micromechanical system includes a substrate with a surface on which the micromechanical system is formed, a transparent cover and a dry film layer arrangement between the surface of the substrate and the transparent cover. The dry film layer arrangement has an opening, so that the micromechanical system adjoins the opening.
Public/Granted literature
- US20080164592A1 APPARATUS AND METHOD FOR HOUSING MICROMECHANICAL SYSTEMS Public/Granted day:2008-07-10
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