Invention Grant
- Patent Title: Electronic devices including flexible electrical circuits and related methods
- Patent Title (中): 电子设备包括柔性电路及相关方法
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Application No.: US12333448Application Date: 2008-12-12
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Publication No.: US07898074B2Publication Date: 2011-03-01
- Inventor: Helmut Eckhardt , Stefan Ufer
- Applicant: Helmut Eckhardt , Stefan Ufer
- Agency: The Eclipse Group LLP
- Agent David P. Gloekler
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
Public/Granted literature
- US20100148345A1 ELECTRONIC DEVICES INCLUDING FLEXIBLE ELECTRICAL CIRCUITS AND RELATED METHODS Public/Granted day:2010-06-17
Information query
IPC分类:
