Invention Grant
US07898076B2 Structure and methods of processing for solder thermal interface materials for chip cooling
有权
用于芯片冷却的焊料热界面材料的加工结构和方法
- Patent Title: Structure and methods of processing for solder thermal interface materials for chip cooling
- Patent Title (中): 用于芯片冷却的焊料热界面材料的加工结构和方法
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Application No.: US11742161Application Date: 2007-04-30
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Publication No.: US07898076B2Publication Date: 2011-03-01
- Inventor: Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
- Applicant: Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Connolly Bove Lodge & Hutz LLP
- Agent Daniel P. Morris
- Main IPC: H01L23/10
- IPC: H01L23/10
Abstract:
Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
Public/Granted literature
- US20080265404A1 Structure and Methods of Processing for Solder Thermal Interface Materials for Chip Cooling Public/Granted day:2008-10-30
Information query
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