Invention Grant
- Patent Title: Nanotube materials for thermal management of electronic components
- Patent Title (中): 纳米管材料用于电子元件的热管理
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Application No.: US11413512Application Date: 2006-04-28
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Publication No.: US07898079B2Publication Date: 2011-03-01
- Inventor: David S. Lashmore , Joseph J. Brown
- Applicant: David S. Lashmore , Joseph J. Brown
- Applicant Address: US NH Concord
- Assignee: Nanocomp Technologies, Inc.
- Current Assignee: Nanocomp Technologies, Inc.
- Current Assignee Address: US NH Concord
- Agency: Greenberg Traurig LLP
- Agent Chinh H. Pham
- Main IPC: H01L23/24
- IPC: H01L23/24 ; H01L23/26 ; H01L23/367 ; H01L23/373 ; B32B9/00 ; H05K7/20

Abstract:
A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a flexible member made from an array of interweaving carbon nanotubes. The heat-conducting medium may also include an upper surface against which a heat source may be placed, an opposing lower surface and edges about the member designed for coupling to a heat sink toward which heat from the heat source can be directed. The heat-conducting medium may also include a pad placed on the upper surface to provide structural support to the member. A method for manufacturing the heat-conducting medium is also provided.
Public/Granted literature
- US20060269670A1 Systems and methods for thermal management of electronic components Public/Granted day:2006-11-30
Information query
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