Invention Grant
- Patent Title: Feedback positioning module
- Patent Title (中): 反馈定位模块
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Application No.: US12163987Application Date: 2008-06-27
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Publication No.: US07898205B2Publication Date: 2011-03-01
- Inventor: Don-Hua Cheng
- Applicant: Don-Hua Cheng
- Applicant Address: TW Taichung
- Assignee: Hiwin Mikrosystem Corp.
- Current Assignee: Hiwin Mikrosystem Corp.
- Current Assignee Address: TW Taichung
- Agent Banger Shia
- Main IPC: G01B7/00
- IPC: G01B7/00 ; F16H55/02

Abstract:
A linear feedback positioning module is provided with a coupling and a drive at one side of a platform having a lead screw, a movable assembly combined on the lead screw and a feedback assembly. The feedback assembly includes a magnetic scale cooperating with a read head. The magnetic scale is combined on the platform and located along the lead screw to cooperate with the lead screw. The linear feedback positioning module is further used with a backend control assembly. By such arrangements, the feedback assembly can correct error at any moment to improve the process and product accuracy and increase the production efficiency and product competitiveness.
Public/Granted literature
- US20090322317A1 Feedback Positioning Module Public/Granted day:2009-12-31
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